Book

- E. Salman and E. G. Friedman, High Performance Integrated Circuit Design, McGraw-Hill, ISBN-10:0071635769, ISBN-13 978-0071635769, September 2012
- E. Salman and E. G. Friedman, 高性能集成電路設計, Electronic Industry Press, ISBN-13 978-7121250903, January 2015 (Chinese Translation)

## Invited Book Chapters

- E. Salman, “On-Chip Regulators for Low Voltage and Portable Systems-on-Chip,” Energy Efficient Technologies: Devices, Circuits, and Systems, pp. 57-79, S. Kurinec and K. Iniewski (Eds.), CRC Press, February 2019 (pdf)
- E. Salman, “Substrate Induced Signal Integrity in 2D and 3D ICs,” Noise Coupling in System-on-Chip, pp. 21-44, T. Noulis (Ed.), CRC Press, December 2017 (pdf)
- E. Salman, “Power and Signal Integrity Challenges in 3D Systems-on-Chip,” Physical Design for 3D Integrated Circuits, pp. 101-126, A. Todri-Sanial and C. S. Tan (Eds.), CRC Press, December 2015 (pdf)
- M. Stanacevic, Y. Lin, and E. Salman, “Analysis and Design of 3-D Potentiostat for Deep Brain Implantable Devices,” Neural Computation, Neural Devices, and Neural Prosthesis, pp. 261-287, Z. Yang (Ed.), Springer, 2014 (pdf)

## Patents

- E. Salman, M. Stanacevic, T. Wan, Y. Karimi, and Y. Huang, “Ultra Low Power Core for Lightweight Encryption,” US Patent Pending
- E. Salman, M. Stanacevic, T. Wan, Y. Karimi, “Radio Frequency Energy Harvesting Apparatus and Method for Utilizing the Same,” US Patent Pending
- C. Sitik, B. Taskin, E. Salman, and W. Liu, “Slew-Driven Clock Tree Synthesis,” US Patent Pending
- A. Dasdan, E. Salman,
- R. M. Secareanu, O. L. Hartin, and E. Salman, “Apparatus and Method For Reducing Noise in Mixed-Signal Circuits and Digital Circuits,” US Patent No 7,834,428

## Journal Publications

- M. Rathore, P. Milder, E. Salman, “Error Probability Models for Voltage-Scaled Multiply-Accumulate Units,”
*IEEE Transactions on Very Large Scale Integration (VLSI) Systems,*to appear - T. Wan, Y. Karimi, M. Stanacevic, and E. Salman, “AC Computing Methodology for RF-Powered IoT Devices,”
*IEEE Transactions on Very Large Scale Integration (VLSI) Systems*, Vol. 27, No. 5, May 2019 - A. Ibrahim, M. Jain, E. Salman, R. Willing, and S. Towfighian, “A Smart Knee Implant Using Triboelectric Energy Harvesters,”
*Smart Materials and Structures*, Vol. 28, No. 2, 2019 - W. Liu, C. Sitik, E. Salman, B. Taskin, S. Sundareswaran, and B. Huang, “SLECTS: Slew-Driven Clock Tree Synthesis,”
*IEEE Transactions on Very Large Scale Integration (VLSI) Systems*, Vol. 27. No 4, pp. 864-874, April 2019 - H, Liu, H. Rui, Y. Lu, Y. Wang, E. Salman, and J. Liang, “Boosting the Efficiency of a Footstep Piezoelectric-Stack Energy Harvester by Using the Synchronized Switch Technology,”
*Journal of Intelligent Material Systems and Structures*, Vol. 30, No. 6, 2019 - C. Yan, J. Dofe, S. Kontak, Q. Yu, and E. Salman, “Hardware-Efficient Logic Camouflaging for Monolithic 3D ICs,”
*IEEE Transactions on Circuits and Systems II: Express Briefs*, Vol. 65, No. 6, pp. 799-803, June 2018 (pdf) - C. Yan and E. Salman, “Mono3D: Open Source Cell Library for Monolithic 3D Integrated Circuits,”
*IEEE Transactions on Circuits and Systems I: Regular Papers*, Vol. 65, No. 3, pp. 1075-1085, March 2018 (pdf) - C. Yan, Z. Gan, and E. Salman, “Package Embedded Spiral Inductor Characterization with Application to Switching Buck Converters,”
*Microelectronics Journal,*Vol. 66, pp. 41-47, August 2017 (pdf) - T. Wan, Y. Karimi, M. Stanacevic, and E. Salman, “Perspective Paper – Can AC Computing be an Alternative for Wirelessly Powered Devices,”
*IEEE Embedded Systems Letters*, Vol. 9, No. 1, pp. 13-16, March 2017 (pdf) - H. Wang and E. Salman, “Closed-Form Expressions for I/O Simultaneous Switching Noise Revisited,”
*IEEE Transactions on Very Large Scale Integration (VLSI) Systems,*Vol. 25, No. 2, pp. 769-773, February 2017 (pdf) - C. Sitik, W. Liu, B. Taskin, and E. Salman, “Design Methodology for Voltage-Scaled Clock Distribution Networks,”
*IEEE Transactions on Very Large Scale Integration (VLSI) Systems,*Vol. 24, No. 10, pp. 3080-3093, October 2016 (pdf) - H. Wang and E. Salman, “Decoupling Capacitor Topologies for TSV-based 3D ICs with Power Gating,”
*IEEE Transactions on Very Large Scale Integration (VLSI) Systems*, Vol. 23, No. 12, pp. 2983-2991, December 2015 (pdf) - Z. Gan, E. Salman, and M. Stanacevic, “Figures-of-Merit to Evaluate the Significance of Switching Noise in Analog Circuits,”
*IEEE Transactions on Very Large Scale Integration (VLSI) Systems*, Vol. 23, No. 12, pp. 2945-2956, December 2015 (pdf) - C. Sitik, E. Salman, L. Filippini, S. J. Yoon, and B. Taskin, “FinFET-Based Low Swing Clocking,”
*ACM Journal on Emerging Technologies in Computing Systems*, Vol. 12, No. 2, pp. 13:1-13:20, August 2015 (pdf) - P. Ji and E. Salman, “Quantifying the Effect of Local Interconnects on On-Chip Power Distribution,”
*Microelectronics Journal*, Vol. 46, No. 3, pp. 258-264, March 2015 (pdf) - H. Wang, M. H. Asgari, and E. Salman, “Compact Model to Efficiently Characterize TSV-to-Transistor Noise Coupling in 3D ICs,”
*Integration, the VLSI Journal*, Vol. 47, No. 3, pp. 296-306, June 2014 (pdf) - S. M. Satheesh and E. Salman, “Power Distribution in TSV Based 3D Processor-Memory Stacks,”
*IEEE Journal on Emerging and Selected Topics in Circuits and Systems*, Vol. 2, No. 4, pp. 692-703, December 2012 (pdf) - E. Salman and E. G. Friedman, “Utilizing Interdependent Timing Constraints to Enhance Robustness in Synchronous Circuits,”
*Microelectronics Journal*, Vol. 43, No. 2, pp. 119-127, February 2012 (pdf) - S. Kose, E. Salman, and E. G. Friedman, “Shielding Methodologies in the Presence of Power/Ground Noise,”
*IEEE Transactions on Very Large Scale Integration (VLSI) Systems*, Vol. 19, No. 8, pp. 1458-1468, August 2011 (pdf) - E. Salman and Q. Qi, “Path Specific Register Design to Reduce Standby Power Consumption,”
*Journal of Low Power Electronics and Applications*, Vol. 1, No. 1, pp. 131-149, April 2011 (pdf) - E. Salman, R. Jakushokas, E. G. Friedman, R. M. Secareanu, and O. L. Hartin, “Methodology for Efficient Substrate Noise Analysis in Large Scale Mixed-Signal Circuits,”
*IEEE Transactions on Very Large Scale Integration (VLSI) Systems*, Vol. 17, No. 10, pp. 1405-1418, October 2009 (pdf) - E. Salman, E. G. Friedman, R. M. Secareanu, and O. L. Hartin, “Identification of Dominant Noise Source and Parameter Sensitivity for Substrate Coupling,”
*IEEE Transactions on Very Large Scale Integration (VLSI) Systems*, Vol. 17, No. 10, pp. 1559-1564, October 2009 (pdf) - E. Salman, E. G. Friedman, R. M. Secareanu, and O. L. Hartin, “Worst Case Power/Ground Noise Estimation Using an Equivalent Transition Time for Resonance,”
*IEEE Transactions on Circuits and Systems – I: Regular Papers*, Vol. 56, No. 5, pp. 997-1004, May 2009 (pdf) - E. Salman, A. Dasdan, F. Taraporevala, K. Kucukcakar, and E. G. Friedman, “Exploiting Setup-Hold Time Interdependence In Static Timing Analysis,”
*IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems*, Vol. 26, No. 6, pp. 1114-1125, June 2007 (pdf)

## Refereed Conference Publications (IEEE / ACM)

- Y. Park and E. Salman, “High Efficiency Fully Integrated On-Chip Regulator for Wide-Range Output Current,”
*IEEE International Symposium on Circuits and Systems*, May 2020 - M. Jain, N. A. Hossain, S. Towfighian, M. Stanacevic, and E. Salman, “System Prototype for a Triboelectric Harvester in a Smart Knee Implant,”
*SPIE Active and Passive Smart Structures and Integrated Systems IX*, April 2020**(finalist for the best paper award)** - M. Jain, A. Ibrahim, E. Salman, M. Stanacevic, R. Willing, and S. Towfighian, “Frontend Electronic System for Triboelectric Harvester in a Smart Knee Implant,”
*IEEE International Midwest Symposium on Circuits and Systems*, August 2019 - P. Shukla, A. Coskun, V. Pavlidis, and E. Salman, “An Overview of Thermal Challenges and Opportunities for Monolithic 3D ICs,”
*ACM/IEEE Great Lakes Symposium on VLSI*, May 2019 - C. Sitik, W. Liu, B. Taskin, and E. Salman, “Low Voltage Clock Tree Synthesis with Local Gate Clusters,”
*ACM/IEEE Great Lakes Symposium on VLSI*, May 2019 - I. Miketic and E. Salman, “Power and Data Integrity in Monolithic 3D Integrated SIMON Core,”
*IEEE International Symposium on Circuits and Systems*, May 2019 - T. Noor and E. Salman, “A Novel Glitch-Free Integrated Clock Gating Cell for High Reliability,”
*IEEE International Symposium on Circuits and Systems*, May 2019 - Y. Huang, T. Wan, E. Salman, and M. Stanacevic, “Signal Shaping at Interface of Wireless Power Harvesting and AC Computational Logic,”
*IEEE International Symposium on Circuits and Systems*, May 2019 - M. Rathore, P. Milder, and E. Salman, “Towards TFET based Approximate Computing for Deep Learning,”
*Government Microcircuit Applications & Critical Technology Conference*, March 2019 - I. Miketic and E. Salman, “Monolithic 3D Integrated Encryption Core,”
*Government Microcircuit Applications & Critical Technology Conference*, March 2019 - A. Ibrahim, M. Jain, E. Salman, R. Willing, and S. Towfighian, “Feasibility of Triboelectric Energy Harvesting and Load Sensing in Total Knee Replacement,”
*The ASME Conference on Smart Materials, Adaptive Structures and Intelligent Systems*, September 2018 - E. Salman, M. Stanacevic, S. Das, and P. Djuric, “Leveraging RF Power for Intelligent Tag Networks,”
*Proceedings of the ACM/IEEE Great Lakes Symposium on VLSI*, pp. 329-334, May 2018 (pdf) - T. Wan and E. Salman, “Ultra Low Power SIMON Core for Lightweight Encryption,”
*Proceedings of the IEEE International Symposium on Circuits and Systems**,*May 2018 (pdf) - M. Rathore and E. Salman, “Error Probability Models to Facilitate Approximate Computing in TFET based Circuits,”
*Proceedings of the IEEE International Symposium on Circuits and Systems**,*May 2018 (pdf) - C. Yan and E. Salman, “Physical Design of Monolithic 3D ICs with Applications to Hardware Security,” Government Microcircuit Applications & Critical Technology Conference, pp. 702-707, March 2018 (pdf)
- T. Wan, E. Salman, and M. Stanacevic, “AC Computing Methodology for RF Powered IoT Security,” Government Microcircuit Applications & Critical Technology Conference, pp. 939-944, March 2018 (pdf)
- C. Yan and E. Salman, “Routing Congestion Aware Cell Library Development for Monolithic 3D ICs,”
*Proceedings of the IEEE International Conference on Rebooting Computing*, November 2017 (pdf) - C. Yan, S. Kontak, H. Wang, and E. Salman, “Open Source Cell Library Mono3D to Develop Large-Scale Monolithic 3D Integrated Circuits,”
*Proceedings of the IEEE International Symposium on Circuits and Systems,*pp. 2581-2584*,*May 2017 (pdf)- See our Mono3D page for more details and download

- T. Wan, Y. Karimi, M. Stanacevic, and E. Salman, “Energy Efficient AC Computing Methodology for Wirelessly Powered IoT Devices,”
*Proceedings of the IEEE International Symposium on Circuits and Systems,*pp. 509-512, May 2017 (pdf) - C. Yan, Z. Gan, and E. Salman, “In-Package Spiral Inductor Characterization for High Efficiency Buck Converters,”
*Proceedings of the IEEE International Symposium on Circuits and Systems,*pp. 2396-2399*,*May 2017 (pdf) - J. Dofe, Z. Zhang, Q. Yu, C. Yan, and E. Salman, “Impact of Power Distribution Network on Power Analysis Attacks in Three-Dimensional Integrated Circuits,”
*Proceedings of the ACM/IEEE Great Lakes Symposium on VLSI*, pp. 327-332, May 2017 (pdf) - J. Dofe, C. Yan, S. Kontak, E. Salman, and Q. Yu, “Transistor-Level Camouflaged Logic Locking Method for Monolithic 3D IC Security,”
*Proceedings of the IEEE Asian Hardware Oriented Security and Trust Symposium*, December 2016 (pdf) - J. Dofe, Q. Yu, H. Wang, and E. Salman, “Hardware Security Threats and Potential Countermeasures in Emerging 3D ICs,”
*Proceedings of the ACM/IEEE Great Lakes Symposium on VLSI*, pp. 69-74, May 2016 (pdf) - T. Wan, E. Salman, and M. Stanacevic, “A New Circuit Design Framework for IoT Devices: Charge Recycling with Wireless Power Harvesting,”
*Proceedings of the IEEE International Symposium on Circuits and Systems*, pp. 2046-2049, May 2016 (pdf) - Y. Park and E. Salman, “On-Chip Hybrid Regulator Topology for Portable SoCs with Near-Threshold Operation,”
*Proceedings of the IEEE Int. Symposium on Circuits and Systems*, pp. 786-789, May 2016 (pdf) - W. Liu, E. Salman, C. Sitik, and B. Taskin, “Exploiting Useful Skew in Gated Low Voltage Clock Trees for High Performance,”
*Proceedings of the IEEE Int. Symposium on Circuits and Systems*, pp. 2595-2598, May 2016 (pdf) - L. Filippini, E. Salman, and B. Taskin, “A Wirelessly Powered System with Charge Recovery Logic,”
*Proceedings of the IEEE International Conference on Computer Design*, pp. 505-510, October 2015 (pdf) - W. Liu, E. Salman, C. Sitik, and B. Taskin, “Clock Skew Scheduling in the Presence of Heavily Gated Clock Networks,”
*Proceedings of the ACM/IEEE Great Lakes Symposium on VLSI*, pp. 283-288, May 2015 (pdf) - M. Rathore, W. Liu, E. Salman, C. Sitik, and B. Taskin, “A Novel Static D Flip-Flop Topology for Low Swing Clocking,”
*Proceedings of the ACM/IEEE Great Lakes Symposium on VLSI*, pp. 301-306, May 2015 (pdf) - S. Fang and E. Salman, “Low Swing TSV Signaling Using Novel Level Shifters with Single Supply Voltage,”
*Proceedings of the IEEE International Symposium on Circuits and Systems*, pp. 1965-1968, May 2015 (pdf) - W. Liu, E. Salman, C. Sitik, and B. Taskin, “Enhanced Level Shifter for Multi-Voltage Operation,”
*Proceedings of the IEEE International Symposium on Circuits and Systems*, pp. 1442-1445, May 2015 (pdf) - H. Wang and E. Salman, “Resource Allocation Methodology for Through-Silicon-Vias and Sleep Transistors in 3D ICs,”
*Proceedings of the IEEE International Symposium on Quality Electronic Design*, pp. 528-532, March 2015**(nominated for the best paper award)**(pdf) - H. Wang and E. Salman, “Enhancing System-Wide Power Integrity in 3D ICs with Power Gating,”
*Proceedings of the IEEE International Symposium on Quality Electronic Design*, pp. 322-326, March 2015 (pdf) - C. Sitik, L. Filipini, E. Salman, and B. Taskin, “High Performance Low Swing Clock Tree Synthesis with Custom D Flip-Flop Design,”
*Proceedings of the IEEE Computer Society Annual Symposium on VLSI*, pp. 498-503, July 2014 (pdf) - H. Wang, M. H. Asgari, and E. Salman, “Efficient Characterization of TSV-to-Transistor Noise Coupling in 3D ICs,”
*Proceedings of the ACM/IEEE Great Lakes Symposium on VLSI*, pp. 71-76, May 2013 (pdf) - S. M. Satheesh and E. Salman, “Effect of TSV Fabrication Technology on Power Distribution in 3D ICs,”
*Proceedings of the ACM/IEEE Great Lakes Symposium on VLSI*, pp. 287-292, May 2013 (pdf) - H. Wang and E. Salman, “Power Gating Methodologies in TSV Based 3D Integrated Circuits,”
*Proceedings of the ACM/IEEE Great Lakes Symposium on VLSI*, pp. 327-328, May 2013 (pdf) - Z. Gan, E. Salman and M. Stanacevic, “Methodology to Determine Dominant Noise Source in a System-on-Chip Based Implantable Device,”
*Proceedings of the IEEE International System-on-Chip Conference*, pp. 115-119, September 2012 (pdf) - S. M. Satheesh and E. Salman, “Design Space Exploration for Robust Power Delivery in TSV Based 3-D Systems-on-Chip,”
*Proceedings of the IEEE International System-on-Chip Conference*, pp. 307-311, September 2012 (pdf) - E. Salman, M. H. Asgari, and M. Stanacevic, “Signal Integrity Analysis of a 2-D and 3-D Integrated Potentiostat for Neurotransmitter Sensing,”
*Proceedings of the IEEE Biomedical Circuits and Systems Conference*, pp. 17-20, November 2011 (pdf) - E. Salman, “Noise Coupling Due to Through Silicon Vias (TSVs) in 3-D Integrated Circuits,”
*Proceedings of the IEEE International Symposium on Circuits and Systems*, pp. 1411-1414, May 2011 (pdf) - E. Salman, “Noise Management in Highly Heterogeneous SoC Based Integrated Circuits,”
*Proceedings of the IEEE International SoC Design Conference*, pp. 1-4, November 2010 (**invited paper**) (pdf) - R. Secareanu, O. Hartin, J. Feddeler, R. Moseley, J. Shepherd, B. Vrignon, J. Yang, Q. Li, H. Zhao, W. Li, L. Wei, E. Salman, R. Wang, D. Blomberg, and P. Parris, “Impact of Low-Doped Substrate Areas on the Reliability of Circuits Subject to EFT Events,”
*Proceedings of the IEEE International SoC Design Conference*, pp. 21-24, November 2010 (pdf) - R. Jakushokas, E. Salman, E. G. Friedman, R. M. Secareanu, O. L. Hartin, and C. Recker, “Compact Substrate Models for Efficient Noise Coupling and Signal Isolation Analysis,”
*Proceedings of the IEEE International Symposium on Circuits and Systems*, pp. 2346-2349, May/June 2010 (pdf) - E. Salman and E. G. Friedman, “Methodology to Achieve Higher Tolerance to Delay Variations in Synchronous Circuits,”
*Proceedings of the ACM/IEEE Great Lakes Symposium on VLSI*, pp. 447-452, May 2010 (pdf) - E. Salman and E. G. Friedman, “Reducing Delay Uncertainty in Deeply Scaled Integrated Circuits Using Interdependent Timing Constraints,”
*Proceedings of the ACM International Workshop on Timing Issues in the Specification and Synthesis of Digital Systems*, pp. 77-82, March 2010 (pdf) - Kose, E. Salman, and E. G. Friedman, “Shielding Methodologies in the Presence of Power/Ground Noise,”
*Proceedings of the IEEE International Symposium on Circuits and Systems*, pp. 2277-2280, May 2009 (pdf) - E. Salman, R. Jakushokas, E. G. Friedman, R. M. Secareanu, and O. L. Hartin, “Contact Merging Algorithm for Efficient Substrate Noise Analysis in Large Scale Circuits,”
*Proceedings of the ACM/IEEE Great Lakes Symposium on VLSI*, pp. 9-14, May 2009 (pdf) - S. Kose, E. Salman, Z. Ignjatovic, and E. G. Friedman, “Pseudo-Random Clocking to Enhance Signal Integrity,”
*Proceedings of the IEEE International System-on-Chip Conference*, pp. 47-50, September 2008 (pdf) - E. Salman and E. G. Friedman, “Methodology for Placing Localized Guard Rings to Reduce Substrate Noise in Mixed-Signal Circuits,”
*Proceedings of the 4th Conference on PhD Research in Microelectronics and Electronics*, pp. 85-88, June 2008 (pdf) - E. Salman, R. Jakushokas, E. G. Friedman, R. M. Secareanu, and O. L. Hartin, “Input Port Reduction for Efficient Substrate Extraction in Large Scale IC’s,”
*Proceedings of the IEEE International Symposium on Circuits and Systems*, pp. 376-379, May 2008 (pdf) - E. Salman, E. G. Friedman, R. M. Secareanu, and O. L. Hartin, “Equivalent Rise Time for Resonance in Power/Ground Noise Estimation,”
*Proceedings of the IEEE International Symposium on Circuits and Systems*, pp. 2422-2425, May 2008 (pdf) - E. Salman, E. G. Friedman, R. M. Secareanu, and O. L. Hartin, “Dominant Substrate Noise Coupling Mechanism for Multiple Switching Gates,”
*Proceedings of the IEEE International Symposium on Quality Electronic Design*, pp. 261-266, March 2008 (pdf) - E. Salman, E. G. Friedman, R. M. Secareanu, and O. L. Hartin, “Substrate Noise Reduction Based On Noise Aware Cell Design,”
*Proceedings of the IEEE International Symposium on Circuits and Systems*, pp. 3227-3230, May 2007 (**Invited paper to special session “The Future of Nanometer SoC Design – Grand Challenges and Opportunities”**) (pdf) - E. Salman, E. G. Friedman, and R. M. Secareanu, “Substrate and Ground Noise Interactions in Mixed-Signal Circuits,”
*Proceedings of the IEEE International System-on-Chip Conference*, pp. 293-296, September 2006 (pdf) - E. Salman, A. Dasdan, F. Taraporevala, K. Kucukcakar, and E. G. Friedman, “Pessimism Reduction in Static Timing Analysis Using Interdependent Setup and Hold Times,”
*Proceedings of the IEEE International Symposium on Quality Electronic Design*, pp. 159-164, March 2006**(nominated for the best paper award)**(pdf) - E. Salman, H. Akin, O. Gursoy, A. Ergintav, I. Tekin, A. Bozkurt, and Y. Gurbuz, “Design of a 3.2 mW PLL Based Clock and Data Recovery Circuit in 90-nm CMOS Technology,”
*Proceedings of the Mediterranean Microwave Symposium*, September 2005 (pdf)

## Nonrefereed Publications and Reports

- W. Liu, C. Sitik, E. Salman, B. Taskin, S. Sundareswaran, and B. Huang, “Slew-Driven Clock Tree Synthesis (SLECTS) Methodology to Facilitate Low Voltage Clocking,” Semiconductor Research Corporation (SRC) Technology Conference (TECHCON), September 2016 (pdf)
- T. Wan, Y. Karimi, E. Salman, and M. Stanacevic, “A New Circuit Design Framework for IoT Devices,”
*Proceedings of the International Conference and Expo on Emerging Technologies for a Smarter World*, October 2015 - W. Liu, E. Salman, C. Sitik, B. Taskin, S. Sundareswaran, and B. Huang, “Circuits and Algorithms to Facilitate Low Swing Clocking in Nanoscale Technologies,” Semiconductor Research Corporation (SRC) Technology Conference (TECHCON), September 2015 (pdf)
- E. Salman and M. Stanacevic, “3-D Integrated Implantable Device for Deep Brain Sensing and Stimulation,”
*Proceedings of the International Conference and Expo on Emerging Technologies for a Smarter World*, November 2011 - G. Bischof, B. Scholnick, and E. Salman, “Fully Integrated PLL Based Clock Generator for Implantable Biomedical Applications,”
*Proc. of the IEEE Annual Conference on Long Island Systems, Applications and Technology*, May 2011 - E. Salman, A. Doboli, and M. Stanacevic, “Noise and Interference Management in 3-D Integrated Wireless Systems,”
*Proc. of the International Conference and Expo on Emerging Technologies for a Smarter World*, September 2010

## Ph.D. Dissertations

- T. Wan,
*AC Computing Methodology for Wirelessly Powered Devices,*PhD Dissertation, Stony Brook University, Stony Brook, NY, December 2019 (pdf) - C. Yan,
*Leveraging Monolithic Integrated Circuit Technology for Emerging Applications,*PhD Dissertation, Stony Brook University, Stony Brook, NY, December 2018 (pdf) - W. Liu,
*Low Voltage Clocking Methodologies for Nanoscale ICs,*PhD Dissertation, Stony Brook University, Stony Brook, NY, January 2018 (pdf) - Z. Gan,
*Design Methodologies to Manage Switching Noise with Applications to Biomedical Acoustic Systems,*PhD Dissertation, Stony Brook University, Stony Brook, NY, August 2017 (pdf) - H. Wang,
*Enhancing Power and Signal Integrity in Three-Dimensional Integrated Circuits*, PhD Dissertation, Stony Brook University, Stony Brook, NY, January 2016 (pdf)

## M.Sc. Theses

- Y. Park, Fully Integrated Hybrid Voltage Regulator for Low Voltage Applications, Master’s Thesis, Stony Brook University, Stony Brook, NY, May 2016 (pdf)
- S. Panda,
*Investigating the Tolerance of Wirelessly Powered Charge-Recycling Logic to Power-Clock Phase Difference Deviations*, Master’s Thesis, Stony Brook University, Stony Brook, NY, May 2016 (pdf) - T. Noor,
*Design of a Novel Glitch-Free Integrated Clock Gating Cell for High Reliability*, Master’s Thesis, Stony Brook University, Stony Brook, NY, May 2016 (pdf) - M. Rathore,
*Design and Analysis of Custom Clock Buffers and a D Flip-Flop for Low Swing Clock Distribution Networks*, Master’s Thesis, Stony Brook University, Stony Brook, NY, May 2014 (pdf) - P. Ji,
*Quantifying the Effect of Local Power Distribution Network and Vias on Power Integrity*, Master’s Thesis, Stony Brook University, Stony Brook, NY, May 2013 - Z. Zhang,
*Comparative Analysis of Near-Threshold and Charge Recovery Circuits for Energy Efficiency and Performance,*Master’s Thesis, Stony Brook University, Stony Brook, NY, May 2013 (pdf) - A. Chandrasekhar,
*Critical Length Estimation for TSV-Based 3D Sub/Near-Threshold Circuits*, Master’s Thesis, Stony Brook University, Stony Brook, NY, May 2013 (pdf) - S. Mungi, MSc Thesis,
*Effective Distance Calculations for On-Chip Decoupling Capacitors in 3D ICs*, Master’s Thesis, Stony Brook University, Stony Brook, NY, May 2013 (pdf) - S. M. Satheesh,
*Power Distribution in TSV Based 3D Processor-Memory Stacks*, Master’s Thesis, Stony Brook University, Stony Brook, NY, May 2012 (pdf) - M. H. Asgari,
*TSV Related Noise Coupling in 3-D Integrated Circuits*, Master’s Thesis, Stony Brook University, Stony Brook, NY, December 2011 (pdf)